FAST Semi was founded in 2003 to service the ever growing device level packaging and failure analysis need. A close working relationship with program managers and product engineers allows us to provide unique and relevant solutions to packaging problems and failure analysis.
FAST Semi In the high pace world of integrated circuit design and manufacturing, fast device turn is our highest priority. Standard jobs at FAST Semi are expected to have a 1-2 day turn. Although time may vary on a job by job basis, our dedication to providing the best quality results will not.
FAST Semi has positioned itself to be unique in the industry. We combine failure analysis, C-SAM, and X-Ray, with the added ability to package your device. This packaging quality, flip chip bump & wire bonding, allows us to provide you with the maximum latitude in analytical device flexibility