FAST Semiconductor Services
Device Retrieval and Packaging
FAST Semiconductor uses many conventional and proprietary processes for integrated circuit device retrieval and flip chip flex analysis.
Because FAST Semiconductor also has packaging capabilities, repackaging of retrieved devices that are assembled into standard packages saves you ATE test time.
Typical Device Analysis and Packaging
- Optical inspection
- X-Ray analysis and void calculations
- C-SAM data collection at several interface levels
- Device decap, COB retrieval or flip chip removal from Flex/PCB
- Bump removal and die cleaning for repackaging or probing
- Wire Bonding die in a new ceramic package for FIB or ATE testing
- Wire Bonding die in a new ceramic package for backside analysis
- Mechanical cross sectioning with SEM documentation
- Dimensional Measurements
- Bond strength analysis
Scanning Acoustic Microscopy
Scanning Acoustic Microscopy (SAM), a non-destructive inspection method, locates internal discontinuities in semiconductor packages, and verifies package reliability. Detection and Verification of complex package designs, such as Stacked Die, encapsulated Flip Chips and Micro BGA's have become critical. Conventional inspection methods, including x-ray and micro-sectioning, are not always adequate to locate these defects, and more manufacturers are turning to SAM to verify the reliability of their packages.
Reactive Ion Etching
FAST Semiconductor uses reactive ion etching to clean organic residues from integrated circuit bond pads prior to wire bonding.
RIE is capable of selectively removing dielectric films, organic residues and most metals used in the manufacture of integrated circuits.
Typical RIE Device Processing
- Removal of the passivation layer
- Removal of thermo set plastic materials
- Ashing organic residues from substrates
- Ashing photo or dielectric films
High Resolution X-Ray Imaging
At FAST Semiconductor, Inc. a VJ Electronix X-10HR high resolution x-ray is incorporated into our device level failure analysis procedure. X-raying allows a trained analyst to pinpoint process failures in prototype and production devices without damage.
Whether it is flip chip analysis or other solder ball assemblies, individual devices can be analyzed in real time for solder voids, wetting, shorts or improper alignment.
Plastic IC's have inherent problems during transfer molding such as wire
sweep, opens, shorts, voids, and delamination.
- Positioning: 5 Axis manipulation
- X-ray tube adjustable voltage range: 10 Kv
- X-ray tube adjustable current range: 10 Ma
- Magnification range: 300X
- Table Size: 8 inches X 10 inches